Invention Application
- Patent Title: METHODS OF FORMING TRANSFER FILMS
- Patent Title (中): 形成转移膜的方法
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Application No.: US14959770Application Date: 2015-12-04
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Publication No.: US20160087246A1Publication Date: 2016-03-24
- Inventor: Evan L. Schwartz , Justin P. Meyer , Olester Benson , Terry O. Collier , Michael Benton Free , Robert F. Kamrath , Mieczyslaw H. Mazurek , David B. Olson , K. Raveesh Shenoy , Martin B. Wolk
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Main IPC: H01L51/52
- IPC: H01L51/52 ; B29D11/00 ; H01L51/00
Abstract:
Methods of making transfer films to form bridged nanostructures are disclosed. The methods include applying a thermally stable backfill layer to a structured surface of a sacrificial template layer.
Public/Granted literature
- US09419250B2 Methods of forming transfer films Public/Granted day:2016-08-16
Information query
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