Invention Application
- Patent Title: HAPTIC FEEDBACK ASSEMBLY
- Patent Title (中): 欢迎反馈组装
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Application No.: US14792267Application Date: 2015-07-06
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Publication No.: US20160091972A1Publication Date: 2016-03-31
- Inventor: Dhaval Chandrakant Patel , Jonah A. Harley , Peteris K. Augenbergs , Derryk C. Davis , Scott J. McEuen , John M. Brock
- Applicant: Apple Inc.
- Main IPC: G06F3/01
- IPC: G06F3/01 ; G06F3/0354 ; G06F3/041
Abstract:
A haptic feedback assembly includes interconnections for mechanically and electrically securing a haptic actuator in a track pad assembly so as to securely and efficiently provide haptic feedback to a user.
Public/Granted literature
- US09939901B2 Haptic feedback assembly Public/Granted day:2018-04-10
Information query
