A multilayer ceramic capacitor provided in a multilayer printed wiring board includes a ceramic body with a plurality of ceramic layers and internal electrodes stacked, and an external electrode including a base layer that includes a sintered metal containing a metal and glass and a plated layer provided on the surface of the base layer, which is provided on an end surface of the ceramic body to be connected to the internal electrodes. The external electrode includes a principal surface portion disposed on a principal surface of the ceramic body. The outermost layer of the plated layer includes a Cu plated layer. The ratio of arithmetic mean roughness (Ra) at the surface of the ceramic body/arithmetic mean roughness (Ra) at the surface of the external electrode satisfies a condition: about 0.06 the arithmetic mean roughness (Ra) at the surface of the ceramic body/the arithmetic mean roughness (Ra) at the surface of the external electrode about 0.97.