发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US14863837申请日： 2015-09-24
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公开(公告)号： US20160093589A1公开(公告)日： 2016-03-31
- 发明人: Yukihiro SATO , Katsuhiko FUNATSU , Takamitsu KANAZAWA , Masahiro KOIDO , Hiroyoshi TAYA
- 申请人： Renesas Electronics Corporation
- 优先权： JP2014-199925 20140930
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/00
摘要：
Reduction in reliability of a semiconductor device is suppressed. A semiconductor device includes a plurality of metal patterns formed on a ceramic substrate, and a plurality of semiconductor chips mounted on the plurality of metal patterns. Also, the plurality of metal patterns include metal patterns MPH and MPU which face each other. In addition, a region which is provided between these metal patterns MPH and MPU and which is exposed from the plurality of metal patterns extends so as to zigzag along an extending direction of the metal pattern MPH.
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