Invention Application
- Patent Title: MODULE AND ELECTRONIC APPARATUS
- Patent Title (中): 模块和电子设备
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Application No.: US14971007Application Date: 2015-12-16
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Publication No.: US20160097660A1Publication Date: 2016-04-07
- Inventor: Masayasu SAKUMA , Yoshihiro KOBAYASHI , Shojiro KITAMURA , Taketo CHINO , Michiharu OGAMI
- Applicant: Seiko Epson Corporation
- Priority: JP2011-122790 20110531
- Main IPC: G01D11/30
- IPC: G01D11/30 ; G01P1/00
Abstract:
A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.
Public/Granted literature
- US10072954B2 Module and electronic apparatus Public/Granted day:2018-09-11
Information query
