发明申请
US20160099200A1 ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
审中-公开
用于半导体器件的铝合金引线框架和相应的制造工艺
- 专利标题： ALUMINUM ALLOY LEAD FRAME FOR A SEMICONDUCTOR DEVICE AND CORRESPONDING MANUFACTURING PROCESS
- 专利标题（中）： 用于半导体器件的铝合金引线框架和相应的制造工艺
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申请号： US14750920申请日： 2015-06-25
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公开(公告)号： US20160099200A1公开(公告)日： 2016-04-07
- 发明人: Laura Ceriati , Paolo Crema , Agatino Minotti
- 申请人： STMICROELECTRONICS S.R.L.
- 优先权： ITTO2014A000785 20141001
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L23/00
摘要：
Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%.
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