Invention Application
- Patent Title: SYSTEM ON CHIP
- Patent Title (中): 芯片系统
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Application No.: US14872774Application Date: 2015-10-01
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Publication No.: US20160099211A1Publication Date: 2016-04-07
- Inventor: Sang-Hoon BAEK , Sun-Young PARK , Sang-Kyu OH , Ha-Young KIM , Jung-Ho DO , Moo-Gyu BAE , Seung-Young LEE
- Applicant: Sang-Hoon BAEK , Sun-Young PARK , Sang-Kyu OH , Ha-Young KIM , Jung-Ho DO , Moo-Gyu BAE , Seung-Young LEE
- Priority: KR10-2015-0056266 20150422
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L27/088

Abstract:
Systems on chips are provided. A system on chip (SoC) includes a first gate line, a second gate line and a third gate line extending in a first direction, a gate isolation region cutting the first gate line, the second gate line and the third gate line and extending in a second direction across the first direction, a first gate contact formed on the second gate line arranged between the first gate line and the third gate line, and electrically connecting the cut second gate line, a second gate contact formed on the first gate line, a third gate contact formed on the third gate line, a first metal line electrically connecting the second gate contact and the third gate contact, and a second metal line electrically connected to the first gate contact.
Public/Granted literature
- US09589955B2 System on chip Public/Granted day:2017-03-07
Information query
IPC分类: