Invention Application
- Patent Title: MINIATURE WAFER-LEVEL CAMERA MODULES
- Patent Title (中): 微型水平摄像机模块
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Application No.: US14969317Application Date: 2015-12-15
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Publication No.: US20160099284A1Publication Date: 2016-04-07
- Inventor: Kenneth Kubala , Paulo E. X. Silveira , Satoru Tachihara
- Applicant: OmniVision Technologies, Inc.
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N5/225

Abstract:
In one aspect, a method includes providing a lens substrate having an array of lenses. The lens substrate includes an overflow region next to each lens of the array. Each overflow region includes an overflow lens material. The method also includes separating the lens substrate into a plurality of smaller lens substrates. Each of the smaller lens substrates has one of the single lens and the plurality of stacked lenses. Separating the lens substrate into the smaller lens substrates may include removing or substantially removing the overflow regions. In one aspect, the method may be performed as a method of making a miniature camera module. Other methods are also described, as are miniature camera modules.
Public/Granted literature
- US09876051B2 Miniature wafer-level camera modules Public/Granted day:2018-01-23
Information query
IPC分类: