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Invention Application
US20160106003A1 AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES 有权
多芯片包装的自动高度补偿和共同平面排除热装置

  • Patent Title: AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES
  • Patent Title (中): 多芯片包装的自动高度补偿和共同平面排除热装置
  • Application No.: US14861892
    Application Date: 2015-09-22
  • Publication No.: US20160106003A1
    Publication Date: 2016-04-14
  • Inventor: Henry C. Bosak , Thomas A. Boyd , Harvey R. Kofstad
  • Applicant: Intel Corporation
  • Main IPC: H05K7/20
  • IPC: H05K7/20 ;  H05K1/02
AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES
Abstract:
Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.
Abstract(Chinese):

本公开的实施例可以包括散热组件，其与电子设备的两个或更多个骰子热耦合。 除热组件可以包括波纹管，以相对于散热组件的另一个表面自动调节散热组件的至少一个表面的位置。 可以描述和/或要求保护其他实施例。

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