Invention Application
- Patent Title: THIN FILM CAPACITOR
- Patent Title (中): 薄膜电容器
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Application No.: US14882013Application Date: 2015-10-13
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Publication No.: US20160111211A1Publication Date: 2016-04-21
- Inventor: Junji AOTANI , Shigeaki TANAKA , Katsuyuki KURACHI , Tatsuo NAMIKAWA , Yuuki ABURAKAWA
- Applicant: TDK CORPORATION
- Priority: JP2014-210937 20141015
- Main IPC: H01G4/12
- IPC: H01G4/12 ; H01G4/005 ; H01G4/33 ; H01G4/30

Abstract:
A thin film capacitor comprising a lower electrode layer, an upper electrode layer, and a dielectric substance layer provided between the lower electrode layer and the upper electrode layer, wherein a dielectric patch member formed of a dielectric material is formed on a surface of the dielectric substance layer on an upper electrode layer side, a cross-sectional structure of the dielectric patch member has a taper angle of 1 to 25 degrees in a cross section perpendicular to the dielectric substance layer, the taper angle being an angle formed by (1) a tangential line tangent to an end portion of the dielectric patch member at a position that is 50% of a maximum height of the dielectric patch member and (2) a line being an interface between the dielectric substance layer and the upper electrode layer, and an area of the dielectric patch member is 100 to 900000 μm2.
Public/Granted literature
- US09818539B2 Thin film capacitor with improved resistance to dielectric breakdown Public/Granted day:2017-11-14
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