Invention Application
- Patent Title: Separation of Chips on a Substrate
-
Application No.: US14977625Application Date: 2015-12-21
-
Publication No.: US20160111255A1Publication Date: 2016-04-21
- Inventor: Manfred Engelhardt , Gudrun Stranzl , Markus Zundel , Hubert Maier
- Applicant: Infineon Technologies AG
- Main IPC: H01J37/32
- IPC: H01J37/32
Abstract:
Various methods and apparatuses are provided relating to separation of a substrate into a plurality of parts. For example, first a partial separation is performed and then the partially separated substrate is completely separated into a plurality of parts.
Public/Granted literature
- US09490103B2 Separation of chips on a substrate Public/Granted day:2016-11-08
Information query
