Invention Application
- Patent Title: WAFER TRANSFER METHOD AND SYSTEM
- Patent Title (中): 转移方法和系统
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Application No.: US14518373Application Date: 2014-10-20
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Publication No.: US20160111311A1Publication Date: 2016-04-21
- Inventor: Chien-Fa LEE , Hsu-Shui LIU , Jiun-Rong PAI , Shou-Wen KUO
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/683 ; H01L21/677 ; H01L21/673
Abstract:
A wafer transfer method includes the following steps. An initial position of a first wafer in a wafer cassette is detected. A picking entry position in the wafer cassette is determined based on the initial position of the first wafer, in which the picking entry position is spaced apart from the initial position of the first wafer. A wafer transfer blade is moved to the picking entry position.
Public/Granted literature
- US09786530B2 Wafer transfer method and system Public/Granted day:2017-10-10
Information query
IPC分类:
