Invention Application
- Patent Title: LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Patent Title (中): 液体喷射和液体喷射装置
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Application No.: US14920679Application Date: 2015-10-22
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Publication No.: US20160114582A1Publication Date: 2016-04-28
- Inventor: Hiroyuki HAGIWARA , Toshinobu YAMAZAKI , Kentaro MURAKAMI , Isao TAKIMOTO , Hidekazu TODOROKI , Tomoo KINOSHITA , Takayuki SHIMOSAKA , Kazushige HAKEDA
- Applicant: SEIKO EPSON CORPORATION
- Priority: JP2014-218559 20141027
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
Provided is a liquid ejecting head including: a first board on which a driving element for ejecting liquid is installed; a second board which is installed on the surface of the first board and covers the driving element; a wiring board that includes a first surface on which a wiring, where a driving signal is supplied to the driving element, is formed and a second surface that is at the opposite side to the first surface, and where the first surface of a first end section is joined to the surface of the first board; and a filling material which covers the wiring by being formed at least between the first surface and a wall surface of the second board, in which the height of the filling material with respect to the surface of the first board is high at the first surface side in comparison to the second surface side.
Public/Granted literature
- US10059106B2 Liquid ejecting head and liquid ejecting apparatus Public/Granted day:2018-08-28
Information query
IPC分类: