Invention Application
US20160118301A1 PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME
审中-公开
具有金属绝缘体金属电容器的封装及其制造方法
- Patent Title: PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 具有金属绝缘体金属电容器的封装及其制造方法
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Application No.: US14990976Application Date: 2016-01-08
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Publication No.: US20160118301A1Publication Date: 2016-04-28
- Inventor: Chen-Hua Yu , Shang-Yun Hou , Wen-Chih Chiou , Jui-Pin Hung , Der-Chyang Yeh , Chiung-Han Yeh
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L49/02 ; H01L21/48 ; H01L25/00 ; H01L21/56
Abstract:
A package includes a chip that has a metal-insulator-metal (MIM) capacitor formed in a first polymer layer and a metallic pillar formed on the MIM capacitor. A molding compound surrounds the chip, a second polymer layer is formed on the chip and the molding compound, a third polymer layer is formed on the second polymer layer, an interconnect structure is formed between the second polymer layer and the third polymer layer and electrically coupled to the metallic pillar and the MIM capacitor, and a bump is formed over and electrically coupled to the interconnect structure.
Public/Granted literature
- US10153205B2 Package with metal-insulator-metal capacitor and method of manufacturing the same Public/Granted day:2018-12-11
Information query
IPC分类:
