Invention Application
- Patent Title: CHIP ANTENNA FOR NEAR FIELD COMMUNICATION AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 用于近场通信的芯片天线及其制造方法
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Application No.: US14830335Application Date: 2015-08-19
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Publication No.: US20160118721A1Publication Date: 2016-04-28
- Inventor: Chulsoon PARK , Hojung KIM , Hongyi KIM , Innyeal OH , Joongho LEE , Taehwan JANG
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Daejeon KR Suwon-si
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Daejeon KR Suwon-si
- Priority: KR10-2014-0144286 20141023
- Main IPC: H01Q9/28
- IPC: H01Q9/28

Abstract:
Provided are chip antennas for near field communication and methods of manufacturing the chip antennas. A chip antenna for near field communication includes a substrate; a first antenna element on the substrate; and a second antenna element on the first antenna element. The substrate, the first antenna element, and the second antenna element are included in a single chip. The first and second antenna elements are formed outside the chip. The substrate is a lower layer including a plurality of devices. The first antenna element is a metal structure having a fish bone shape. The second antenna element is a dipole antenna.
Public/Granted literature
- US09755313B2 Chip antenna for near field communication and method of manufacturing the same Public/Granted day:2017-09-05
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