Invention Application
- Patent Title: Channel Bonding Synchronization
- Patent Title (中): 通道绑定同步
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Application No.: US14984742Application Date: 2015-12-30
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Publication No.: US20160119069A1Publication Date: 2016-04-28
- Inventor: Rajesh Mamidwar , Xuemin Chen , Victor Hou , Guangcai Zhou
- Applicant: Broadcom Corporation
- Main IPC: H04J3/06
- IPC: H04J3/06

Abstract:
Different data communication architectures deliver a wide variety of content, including audio and video content, to consumers. The architectures employ channel bonding to deliver more bandwidth than any single communication channel can carry. In some implementations, the communication architectures distribute data streams to bonded channels that are clocked independently. A system is provided for synchronizing the bonded channels.
Public/Granted literature
- US10079727B2 Channel bonding synchronization Public/Granted day:2018-09-18
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