Invention Application
- Patent Title: Lithography Patterning Technique
- Patent Title (中): 平版印刷图案技术
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Application No.: US14529944Application Date: 2014-10-31
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Publication No.: US20160124310A1Publication Date: 2016-05-05
- Inventor: Chang Lilin , Ching-Yu Chang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: G03F7/32
- IPC: G03F7/32 ; G03F7/20

Abstract:
A method for lithography patterning includes providing a substrate; forming a material layer over the substrate; exposing the material layer to a radiation, resulting in an exposed material layer; and removing a portion of the exposed material layer in a developer, resulting in a patterned material layer. The developer is an alkaline aqueous solution having an organic base that is a quaternary ammonium hydroxide. In an embodiment, the organic base has a bulky group in its side chain, reducing its etching distance. In another embodiment, the organic base includes electron withdrawing groups, reducing its basicity. In yet another embodiment, the developer has a loading of the quaternary ammine ranging from about 0.01% to about 2.37%. The developer results in reduced line edge roughness and reduced line width roughness in the patterned material layer.
Public/Granted literature
- US09645497B2 Lithography patterning technique Public/Granted day:2017-05-09
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