Invention Application
- Patent Title: SEMICONDUCTOR ARRANGEMENT, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP
- Patent Title (中): 半导体装置，制造半导体芯片的方法
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Application No.: US14926258Application Date: 2015-10-29
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Publication No.: US20160126211A1Publication Date: 2016-05-05
- Inventor: Olaf Hohlfeld , Edward Fuergut , Horst Groeninger , Juergen Hoegerl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102014222189.7 20141030
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor assembly is described. In accordance with one example of the invention, the semiconductor assembly comprises a semiconductor body, a top main electrode arranged on a top side, a bottom main electrode arranged on an underside, and a control electrode arranged on the top side. The semiconductor assembly further includes a spring element for the pressure contacting of the control electrode with a pressure force generated by the spring element.
Public/Granted literature
- US09595502B2 Spring contact for semiconductor chip Public/Granted day:2017-03-14
Information query
IPC分类:
