Invention Application
- Patent Title: Wire Harness Assembly System
- Patent Title (中): 线束装配系统
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Application No.: US14884240Application Date: 2015-10-15
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Publication No.: US20160126687A1Publication Date: 2016-05-05
- Inventor: Rodney G. Rouleau , Janina B. Nebes , Robert W. Kossak
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Main IPC: H01R43/20
- IPC: H01R43/20

Abstract:
A wire harness assembly system is disclosed. The wire harness assembly system includes a grid tile designed to receive repositionable accessories to route wires along the grid tile. The grid tile includes a plurality of keyed holes extending from the top of the grid tile, through the grid tile, to the bottom of the grid tile. The grid tile also includes a locking surface on the bottom of the grid tile. The locking surface complements the plurality of keyed holes to receive the repositionable accessory and to maintain the repositionable accessory in a locked position.
Public/Granted literature
- US10256011B2 Wire harness assembly system Public/Granted day:2019-04-09
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