Invention Application
- Patent Title: MULTILAYER ELECTRONIC COMPONENT
- Patent Title (中): 多层电子元件
-
Application No.: US14869160Application Date: 2015-09-29
-
Publication No.: US20160126917A1Publication Date: 2016-05-05
- Inventor: Young Ghyu AHN , Byoung Hwa LEE , Min Cheol PARK
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0151919 20141104
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H03H1/00

Abstract:
A multilayer electronic component includes: a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body, wherein the body includes a capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween.
Public/Granted literature
- US09843299B2 Multilayer electronic component Public/Granted day:2017-12-12
Information query