Invention Application
- Patent Title: INJECTION MOLDING METHOD AND INJECTION MOLDING DIE
- Patent Title (中): 注射成型方法和注射成型模具
-
Application No.: US14996044Application Date: 2016-01-14
-
Publication No.: US20160129649A1Publication Date: 2016-05-12
- Inventor: Masaki OTSUKA , Koki IWASAWA , Shigeya SUGATA , Yoshitaka OTSUKA
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-197567 20130924
- Main IPC: B29D11/00
- IPC: B29D11/00 ; B29C45/18 ; B29C45/00

Abstract:
An injection molding method includes a supply step of simultaneously supplying molten resins to a cavity portion from two gate portions and an associating step of associating the molten resins supplied from the two gate portions in a central part of the cavity portion. The supply step supplies the molten resins to the cavity portion from the two gate portions which substantially face each other around the cavity portion. The associating step includes at least one of a first step in the supply step of simultaneously starting the supply of the molten resins to the cavity portion from the two gate portions, and a second step in the supply step of simultaneously starting the injection of the molten resins into the cavity portion from the two gate portions at the same injection rate.
Public/Granted literature
- US10022926B2 Injection molding method and injection molding die Public/Granted day:2018-07-17
Information query