发明申请
US20160141230A1 SEMICONDUCTOR DEVICE AND LEAD FRAME HAVING VERTICAL CONNECTION BARS
有权
具有垂直连接条的半导体器件和引线框架
- 专利标题: SEMICONDUCTOR DEVICE AND LEAD FRAME HAVING VERTICAL CONNECTION BARS
- 专利标题(中): 具有垂直连接条的半导体器件和引线框架
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申请号: US14677964申请日: 2015-04-02
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公开(公告)号: US20160141230A1公开(公告)日: 2016-05-19
- 发明人: Peng Liu , Qingchun He , Ping Wu
- 申请人: Peng Liu , Qingchun He , Ping Wu
- 优先权: CN201410858172.2 20141118
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L21/48 ; H01L21/56 ; H01L23/31
摘要:
A semiconductor device includes a lead frame having a die support area and a plurality of inner and outer row leads surrounding the die support area, and a semiconductor die mounted on the die support area and electrically connected to the leads with bond wires. A molding material encapsulates the semiconductor die, the bond wires, and the leads, and defines a package body. The semiconductor device further includes connection bars extending vertically from the leads to a top surface of the package body. The connection bars connect the inner row leads to respective ones of the outer row leads before the molding process is performed.