发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US14899514申请日： 2014-06-05
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公开(公告)号： US20160141272A1公开(公告)日： 2016-05-19
- 发明人: Susumu Inakawa
- 申请人： PS4 Luxco S.a.r.l.
- 优先权： JP2013-127216 20130618
- 国际申请： PCT/JP2014/064924 WO 20140605
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L23/498 ; H01L23/00
摘要：
A semiconductor device which is provided with: a wiring substrate which has a first region, and a relay pad and a connection pad that are arranged outside the first region; a first semiconductor chip which has an electrode pad that is formed on one surface, and which is mounted on the first region of the wiring substrate; a first wire that connects the electrode pad and the relay pad with each other; and a second wire that connects the relay pad and the connection pad with each other.
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