Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
- Patent Title (中): 半导体器件
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Application No.: US14943103Application Date: 2015-11-17
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Publication No.: US20160148919A1Publication Date: 2016-05-26
- Inventor: Isamu NISHIMURA
- Applicant: ROHM CO., LTD.
- Priority: JP2014-238584 20141126
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/48 ; H01L25/065 ; H01L23/552 ; H01L23/66 ; H01L23/528 ; H01L23/31
Abstract:
A semiconductor device includes a semiconductor substrate, a conducting portion, and a sealing resin. The substrate has a main surface and is formed with a recessed portion in the main surface. The conducting portion is formed on the substrate. The sealing resin is disposed in the recessed portion. The conducting portion includes a first wiring layer and a second wiring layer both formed in the recessed portion. The second wiring layer is closer to the main surface than is the first wiring layer in the normal direction of the main surface.
Public/Granted literature
- US09899360B2 Semiconductor device Public/Granted day:2018-02-20
Information query
IPC分类:
