Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US15001767Application Date: 2016-01-20
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Publication No.: US20160148923A1Publication Date: 2016-05-26
- Inventor: Yoshito NAKAZAWA , Yuji YATSUDA
- Applicant: Renesas Electronics Corporation
- Priority: JP2005-147914 20050520
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/78

Abstract:
A semiconductor device having a field-effect transistor, including a trench in a semiconductor substrate, a first insulating film in the trench, an intrinsic polycrystalline silicon film over the first insulating film, and first conductivity type impurities in the intrinsic polycrystalline silicon film to form a first conductive film. The first conductive film is etched to form a first gate electrode in the trench. A second insulating film is also formed in the trench above the first insulating film and the first gate electrode, and a first conductivity type doped polycrystalline silicon film, having higher impurity concentration than the first gate electrode is formed over the second insulating film. The doped polycrystalline silicon film is provided in an upper part of the trench to form a second gate electrode.
Public/Granted literature
- US09478530B2 Semiconductor device and manufacturing method of the same Public/Granted day:2016-10-25
Information query
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