发明申请
- 专利标题： CERAMIC-ENCAPSULATED THERMOPOLYMER PATTERN OR SUPPORT WITH METALLIC PLATING
- 专利标题（中）： 陶瓷封装热塑型材或金属镀层支持
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申请号： US14903903申请日： 2014-07-09
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公开(公告)号： US20160158964A1公开(公告)日： 2016-06-09
- 发明人: Michael S. Miarecki , Joseph Parkos , Gary M. Lomasney , Charles R. Watson
- 申请人： UNITED TECHNOLOGIES CORPORATION
- 国际申请： PCT/US2014/045879 WO 20140709
- 主分类号： B28B7/34
- IPC分类号： B28B7/34 ; B28B11/04 ; B28B11/24 ; F01D11/08 ; C04B35/76 ; F01D5/28 ; F01D5/18 ; B28B1/24 ; C04B35/80
摘要：
A method for fabricating a ceramic component is disclosed. The method may comprise: 1) forming a polymer template having a shape that is an inverse of a shape of the ceramic component, 2) placing the polymer template in a mold; 3) injecting the polymer template with a ceramic slurry, 4) firing the ceramic slurry at a temperature to produce a green body, and 5) sintering the green body at an elevated temperature to provide the ceramic component.
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