Invention Application
- Patent Title: THIN FILM CAPACITOR
- Patent Title (中): 薄膜电容器
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Application No.: US14953807Application Date: 2015-11-30
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Publication No.: US20160163463A1Publication Date: 2016-06-09
- Inventor: Tatsuo NAMIKAWA , Junji AOTANI , Katsuyuki KURACHI , Yuuki ABURAKAWA , Shigeaki TANAKA
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2014-246925 20141205
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/224 ; H01G4/228 ; H01G4/008

Abstract:
A thin film capacitor comprises: a laminated body that has a base electrode, a dielectric layer and an upper electrode layer; a protective layer covering the base electrode, the dielectric layer and the upper electrode layer, and includes a first through-hole that reaches the base electrode, and a second through-hole that reaches the upper electrode layer; a first extraction electrode in the first through-hole and electrically connected with the base electrode; a second extraction electrode in the second through-hole and electrically connected with the upper electrode layer; a first terminal electrode on the protective layer, and connected with the base electrode through the first extraction electrode; and a second terminal electrode on the protective layer, and connected with the upper electrode layer through the second extraction electrode. Young's modulus of the protective layer is equal to or higher than 0.1 GPa and equal to or lower than 2.0 GPa.
Public/Granted literature
- US09831039B2 Thin film capacitor Public/Granted day:2017-11-28
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