Invention Application
US20160172272A1 INTEGRATED CIRCUIT (IC) PACKAGE WITH A SOLDER RECEIVING AREA AND ASSOCIATED METHODS
有权
集成电路（IC）封装与焊接接收区域及相关方法
- Patent Title: INTEGRATED CIRCUIT (IC) PACKAGE WITH A SOLDER RECEIVING AREA AND ASSOCIATED METHODS
- Patent Title (中): 集成电路（IC）封装与焊接接收区域及相关方法
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Application No.: US14567070Application Date: 2014-12-11
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Publication No.: US20160172272A1Publication Date: 2016-06-16
- Inventor: Wing Shenq WONG
- Applicant: STMICROELECTRONICS PTE LTD
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/065 ; H01L21/56 ; H01L23/31 ; H01L23/00
Abstract:
A single chip integrated circuit (IC) package includes a die pad, and a spacer ring on the die pad defining a solder receiving area. A solder body is on the die pad within the solder receiving area. An IC die is on the spacer ring and is secured to the die pad by the solder body within the solder receiving area. Encapsulating material surrounds the die pad, spacer ring, and IC die. For a multi-chip IC package, a dam structure is on the die pad and defines multiple solder receiving areas. A respective solder body is on the die pad within a respective solder receiving area. An IC die is within each respective solder receiving area and is held in place by a corresponding solder body. Encapsulating material surrounds the die pad, dam structure, and plurality of IC die.
Public/Granted literature
- US09972557B2 Integrated circuit (IC) package with a solder receiving area and associated methods Public/Granted day:2018-05-15
Information query
IPC分类:
