Invention Application
US20160172297A1 DESIGNED-BASED INTERCONNECT STRUCTURE IN SEMICONDUCTOR STRUCTURE
审中-公开
半导体结构中基于设计的互连结构
- Patent Title: DESIGNED-BASED INTERCONNECT STRUCTURE IN SEMICONDUCTOR STRUCTURE
- Patent Title (中): 半导体结构中基于设计的互连结构
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Application No.: US15050087Application Date: 2016-02-22
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Publication No.: US20160172297A1Publication Date: 2016-06-16
- Inventor: Chih-Liang CHEN , Chih-Ming LAI , Yung-Sung YEN , Kam-Tou SIO , Tsong-Hua OU , Chun-Kuang CHEN , Ru-Gun LIU , Shu-Hui SUNG , Charles Chew-Yuen YOUNG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/118 ; H01L27/02 ; H01L23/522

Abstract:
Semiconductor structures are provided. The semiconductor structure includes a plurality of gate structures extending in a first direction formed over a substrate. The gate structures follow the following equation: 0.2 P gate min + 0.35 L gate min + 0.3 H gate min - 20 0.2 L gate min + 0.8 H gate min - 5 × 0.3 L gate min + 0.3 H gate min + 5 38 ≤ 0.32 Pgate min is the minimum value among gate pitches of the gate structures, and Lgate min is the minimum value among gate lengths of the gate structures. Hgate min is the minimum value among gate heights of the gate structures.
Public/Granted literature
- US09754881B2 Designed-based interconnect structure in semiconductor structure Public/Granted day:2017-09-05
Information query
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