Invention Application
- Patent Title: ULTRASONIC PROBE
- Patent Title (中): 超声探头
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Application No.: US14879188Application Date: 2015-10-09
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Publication No.: US20160174939A1Publication Date: 2016-06-23
- Inventor: Kyung Il CHO , Jong Keun SONG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2014-0184621 20141219
- Main IPC: A61B8/00
- IPC: A61B8/00

Abstract:
An ultrasonic probe includes: a transducer; a driving element electrically coupled to the transducer; a backing layer provided underneath the transducer and the driving element in a longitudinal direction of the ultrasonic probe, and configured to absorb heat generated from the transducer and the driving element and to absorb vibrations generated by the transducer; a heat spreader provided underneath the backing layer in the longitudinal direction of the ultrasonic probe and configured to absorb the heat from the backing layer; a heat pipe including a first contact portion contacting the heat spreader and a second contact portion in contact with the first contact portion; and a heat radiation plate configured to contact the second contact portion and transfer the heat from the heat spreader to an exterior of the ultrasonic probe.
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