发明申请
- 专利标题: STRESS RELIEF STRUCTURES IN PACKAGE ASSEMBLIES
- 专利标题(中): 包装组合中的应力消除结构
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申请号: US15062570申请日: 2016-03-07
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公开(公告)号: US20160190073A1公开(公告)日: 2016-06-30
- 发明人: Hsien-Wei CHEN
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/16 ; H01L25/065
摘要:
A semiconductor package structure includes a substrate; and a die region having a plurality of dies disposed on the substrate. A first die of the plurality of dies is larger than a second die of the plurality of dies. The semiconductor package structure further includes a plurality of stress relief structures on the substrate. At least one stress relief structure of the plurality of stress relief structures is at a corner of the substrate. Each stress relief structure is spaced from a closest die of the plurality of dies by a first distance. Upper surfaces of each stress relief structure of the plurality of stress relief structures are unconnected.
公开/授权文献
- US09818700B2 Stress relief structures in package assemblies 公开/授权日:2017-11-14