Invention Application
- Patent Title: THICKNESS MEASURING APPARATUS AND THICKNESS MEASURING METHOD
- Patent Title (中): 厚度测量装置和厚度测量方法
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Application No.: US14988332Application Date: 2016-01-05
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Publication No.: US20160202038A1Publication Date: 2016-07-14
- Inventor: Jong-Ahn Kim , Jae-Wan Kim , Jae-Yong Lee , Jae-Heun Woo
- Applicant: Korea Research Institute of Standards and Science
- Priority: KR10-2015-0004240 20150112
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01B9/02 ; G06T7/00 ; H04N7/18 ; H04N5/225

Abstract:
A thickness measuring apparatus and a thickness measuring method. The thickness measuring apparatus includes a light source outputting an extended monochromatic light with coherence; a collimating lens converting output light of the light source into incident beam of parallel ray; a beam splitter reflecting and providing the incident beam to a measurement target and transmitting first reflection light reflected on a top surface of the measurement target and second reflection light reflected on a bottom surface of the measurement target; an imaging lens disposed between the measurement target and the beam splitter with a predetermined focal distance to receive and provide the incident beam to a measurement position of the measurement target disposed on the focal distance; a camera photographing an interference fringe formed by the first and second reflection lights and outputting an interference fringe image; and a processing part.
Public/Granted literature
- US09927224B2 Thickness measuring apparatus and thickness measuring method Public/Granted day:2018-03-27
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