Invention Application
- Patent Title: METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION
- Patent Title (中): 用于光子整合的异质基板结合的方法和系统
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Application No.: US14880936Application Date: 2015-10-12
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Publication No.: US20160202415A1Publication Date: 2016-07-14
- Inventor: Stephen B. Krasulick , John Dallesasse
- Applicant: Skorpios Technologies, Inc.
- Applicant Address: US NM Albuquerque
- Assignee: SKORPIOS TECHNOLOGIES, INC.
- Current Assignee: SKORPIOS TECHNOLOGIES, INC.
- Current Assignee Address: US NM Albuquerque
- Main IPC: G02B6/122
- IPC: G02B6/122 ; G02B6/136 ; G02B6/12

Abstract:
A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
Public/Granted literature
- US09709735B2 Method and system for heterogeneous substrate bonding for photonic integration Public/Granted day:2017-07-18
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