Invention Application
- Patent Title: METHOD FOR THE SURFACE TREATMENT OF A SEMICONDUCTOR SUBSTRATE
- Patent Title (中): 半导体衬底的表面处理方法
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Application No.: US15077671Application Date: 2016-03-22
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Publication No.: US20160203973A1Publication Date: 2016-07-14
- Inventor: Vincenza Di Palma , Fabrizio Porro
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Priority: ITTO2014A001089 20141222
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/306

Abstract:
To apply an anti-wetting coating to a substrate of a semiconductor material, a method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material.
Public/Granted literature
- US09724921B2 Method for the surface treatment of a semiconductor substrate Public/Granted day:2017-08-08
Information query
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