Invention Application
US20160204052A1 PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING DELAMINATION
有权
包装半导体器件具有预防分层的LEADFRAME特性
- Patent Title: PACKAGED SEMICONDUCTOR DEVICE HAVING LEADFRAME FEATURES PREVENTING DELAMINATION
- Patent Title (中): 包装半导体器件具有预防分层的LEADFRAME特性
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Application No.: US14592011Application Date: 2015-01-08
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Publication No.: US20160204052A1Publication Date: 2016-07-14
- Inventor: Sueann Lim Wei Fen , Lee Han Meng@ Eugene Lee , Anis Fauzi Bin Abdul Aziz
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/78 ; H01L21/56 ; H01L21/48 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor device has a leadframe with a first (401a) and a parallel second surface, and an assembly pad (410) bordered by two opposing sides, which include a plurality of through-holes (420) from the first to the second pad surface. Another pad side includes one or more elongated windows (421) between the pad surfaces. The second pad surface includes a plurality of grooves. The leadframe further has a plurality of leads (430) with opposite elongated sides castellated by indents (431). Layers (440) of bondable metals are restricted to localized areas surrounding bond spots. A semiconductor chip (450) is attached to the pad and wire-bonded (460) to the bond spots. A package (470) encapsulates the chip, wires, pad, and lead portions, and secures the leadframe into the package by filling the through-holes, windows, grooves, and indents.
Public/Granted literature
- US09515009B2 Packaged semiconductor device having leadframe features preventing delamination Public/Granted day:2016-12-06
Information query
IPC分类:
