Invention Application
- Patent Title: STRUCTURE AND FORMATION METHOD OF FINFET DEVICE
- Patent Title (中): FINFET器件的结构和形成方法
-
Application No.: US14592591Application Date: 2015-01-08
-
Publication No.: US20160204260A1Publication Date: 2016-07-14
- Inventor: Kuo-Cheng CHING
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- Current Assignee Address: TW Hsin-Chu
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/423 ; H01L29/66 ; H01L21/02 ; H01L27/088 ; H01L29/06

Abstract:
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a semiconductor substrate and a fin channel structure over the semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin channel structure. The semiconductor device structure further includes a source/drain structure adjacent to the fin channel structure and a doped region between the semiconductor substrate and the fin channel structure. In addition, the semiconductor device structure includes a blocking layer between the fin channel structure and the doped region.
Public/Granted literature
- US09761723B2 Structure and formation method of finFET device Public/Granted day:2017-09-12
Information query
IPC分类: