Invention Application
- Patent Title: THERMOELECTRIC MODULE, AND HEAT CONVERSION APPARATUS COMPRISING THE SAME
- Patent Title (中): 热电模块和包含其的热转换装置
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Application No.: US14913220Application Date: 2014-08-20
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Publication No.: US20160204329A1Publication Date: 2016-07-14
- Inventor: Yong Sang CHO , Sang Gon KIM , Sook Hyun KIM , Chae Hoon KIM , Myoung Lae ROH , Jong Bae SHIN , Boone WON , Jong Min LEE
- Applicant: LG INNOTEK CO., LTD.
- Priority: KR10-2013-0098632 20130820
- International Application: PCT/KR2014/007735 WO 20140820
- Main IPC: H01L35/32
- IPC: H01L35/32
Abstract:
The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.
Public/Granted literature
- US09947854B2 Thermoelectric module, and heat conversion apparatus comprising the same Public/Granted day:2018-04-17
Information query
IPC分类:
