Invention Application
- Patent Title: INTEGRATED CONTROL MODULE FOR COMMUNICATION SYSTEM ON A CHIP FOR SILICON PHOTONICS
- Patent Title (中): 硅光电子芯片通信系统集成控制模块
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Application No.: US15078661Application Date: 2016-03-23
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Publication No.: US20160204874A1Publication Date: 2016-07-14
- Inventor: Radhakrishnan L. NAGARAJAN
- Applicant: INPHI CORPORATION
- Main IPC: H04B10/54
- IPC: H04B10/54 ; H04J14/02 ; H04L7/00 ; H04B10/40

Abstract:
In an example, an integrated system-on-chip device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. A control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.
Public/Granted literature
- US09391711B1 Integrated control module for communication system on a chip for silicon photonics Public/Granted day:2016-07-12
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