Invention Application
- Patent Title: PRINTED BOARD AND METHOD FOR MOUNTING ON PRINTED BOARD
- Patent Title (中): 印刷板和打印板安装方法
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Application No.: US14912677Application Date: 2014-09-11
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Publication No.: US20160205768A1Publication Date: 2016-07-14
- Inventor: Kazuhiro KASHIWAKURA
- Applicant: NEC CORPORATION
- Priority: JP2013-197419 20130924
- International Application: PCT/JP2014/004679 WO 20140911
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K3/40 ; H05K1/11
Abstract:
To provide a printed board that solves the problem of transmission characteristics deterioration, the disclosed printed board includes a substrate, a circular signal pad that is provided on the substrate, a doughnut-shaped ground pad, which sandwiches the substrate that surrounds, in a doughnut shape, the signal pad, and which surrounds the outer circumference of the substrate, and one or more recessed sections that are disposed on the substrate that surrounds, in the doughnut shape, the signal pad.
Public/Granted literature
Information query
