Invention Application
- Patent Title: WIRING HARNESS ASSEMBLY OF DOOR MODULE
- Patent Title (中): 门模组接线束组件
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Application No.: US15014162Application Date: 2016-02-03
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Publication No.: US20160221517A1Publication Date: 2016-08-04
- Inventor: JAE WON LEE , JAE IN YU , HANG CHUL KO , SUNG IK CHO , HUE YEON AN
- Applicant: JAE WON LEE , JAE IN YU , HANG CHUL KO , SUNG IK CHO , HUE YEON AN
- Applicant Address: KR SEOUL
- Assignee: SEOYON E-HWA CO., LTD.
- Current Assignee: SEOYON E-HWA CO., LTD.
- Current Assignee Address: KR SEOUL
- Priority: KR1020150016589 20150203
- Main IPC: B60R16/02
- IPC: B60R16/02 ; H01B7/00 ; B60J5/04 ; H05K1/02
Abstract:
Disclosed herein is a wiring harness assembly of a door module, which includes: an FPCB (Flexible Printed Circuit Board) connected to an external power supply and configured to supply electricity to a plurality of electric devices installed in the door module; and a cover member coupled to the FPCB while protecting the FPCB. Since the wiring harness assembly can simplify the structure, the assembling performance can be improved, and the unit price of products can be reduced.
Public/Granted literature
- US09580027B2 Wiring harness assembly of door module Public/Granted day:2017-02-28
Information query
