Invention Application
US20160222195A1 INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RADIATION SUBSTRATE USING THE SAME
有权
无机填充物，包含相同的树脂组合物和使用其的热辐射基材
- Patent Title: INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RADIATION SUBSTRATE USING THE SAME
- Patent Title (中): 无机填充物，包含相同的树脂组合物和使用其的热辐射基材
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Application No.: US14638474Application Date: 2015-03-04
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Publication No.: US20160222195A1Publication Date: 2016-08-04
- Inventor: Sang A JU , Hyun Gu IM , Jae Man PARK
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2015-0014570 20150129
- Main IPC: C08K9/06
- IPC: C08K9/06 ; C08K3/22 ; C08K9/02
Abstract:
An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
Public/Granted literature
- US09505914B2 Inorganic filler, resin composition comprising the same and heat radiation substrate using the same Public/Granted day:2016-11-29
Information query
