Invention Application
- Patent Title: OUTER DIAMETER PLATFORM COOLING HOLE SYSTEM AND ASSEMBLY
- Patent Title (中): 外径平台冷却孔系统和组件
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Application No.: US14627915Application Date: 2015-02-20
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Publication No.: US20160245093A1Publication Date: 2016-08-25
- Inventor: Russell Deibel , Matthew S. Gleiner
- Applicant: United Technologies Corporation
- Applicant Address: US CT Hartford
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Hartford
- Main IPC: F01D5/18
- IPC: F01D5/18 ; F02C7/18 ; F02C3/04

Abstract:
An airfoil component is described herein. The airfoil component may include an OD platform comprising a gaspath face and a non-gaspath face coupled together via a plurality of cooling holes. The airfoil component may include an airfoil extending in from the outer diameter platform. The plurality of cooling holes comprises a plurality of groups of cooling holes disposed in the outer diameter platform proximate a suction side of the airfoil and a pressure side of the airfoil.
Public/Granted literature
- US09957894B2 Outer diameter platform cooling hole system and assembly Public/Granted day:2018-05-01
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