发明申请
- 专利标题： SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 半导体封装及其制造方法
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申请号： US15049872申请日： 2016-02-22
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公开(公告)号： US20160247767A1公开(公告)日： 2016-08-25
- 发明人: Do Hyung Kim , Dae Joon Park , See Won Kim , Jung Soo Park
- 申请人： Amkor Technology, Inc.
- 优先权： KR10-2015-0024957 20150223
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L23/498
摘要：
A semiconductor package and a method of manufacturing a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor packages, and methods of making thereof, that comprise a cover layer that enhances reliability of the semiconductor packages.
公开/授权文献
- US09633939B2 Semiconductor package and manufacturing method thereof 公开/授权日：2017-04-25
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