发明申请
US20160247996A1 LARGE FOOTPRINT, HIGH POWER DENSITY THERMOELECTRIC MODULES FOR HIGH TEMPERATURE APPLICATIONS 审中-公开
用于高温应用的大功率密度热电模块

LARGE FOOTPRINT, HIGH POWER DENSITY THERMOELECTRIC MODULES FOR HIGH TEMPERATURE APPLICATIONS
摘要:
KiloWatt-level, large footprint, high power density thermoelectric modules are disclosed for high temperature applications. The thermoelectric modules utilize a compliant interface that reduces thermal mismatch stress and allows thermoelectric devices to be fabricated with dimensions greater than 6×6 cm.
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