Invention Application
- Patent Title: HIGH-CONDUCTIVITY BONDING OF METAL NANOWIRE ARRAYS
- Patent Title (中): 金属纳米阵列的高电导率结合
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Application No.: US15006658Application Date: 2016-01-26
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Publication No.: US20160250710A1Publication Date: 2016-09-01
- Inventor: John A. Starkovich , Edward M. Silverman , Jesse B. Tice , Hsiao-Hu Peng , Michael T. Barako , Kenneth E. Goodson
- Applicant: Northrop Grumman Systems Corporation , The Board of Trustees of the Leland Stanford Junior University
- Main IPC: B23K20/02
- IPC: B23K20/02 ; C25D7/06 ; B23K1/00 ; C25D3/48 ; C25D5/48 ; C25D5/02 ; C25D9/02 ; C25D3/30
Abstract:
A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.
Public/Granted literature
- US09468989B2 High-conductivity bonding of metal nanowire arrays Public/Granted day:2016-10-18
Information query
