发明申请
US20160268263A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
半导体器件及其制造方法

  • 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
  • 专利标题(中): 半导体器件及其制造方法
  • 申请号: US14734140
    申请日: 2015-06-09
  • 公开(公告)号: US20160268263A1
    公开(公告)日: 2016-09-15
  • 发明人: Ki Hong LEESeung Ho PYI
  • 申请人: SK hynix Inc.
  • 优先权: KR10-2015-0033817 20150311; KR10-2015-0054732 20150417
  • 主分类号: H01L27/115
  • IPC分类号: H01L27/115
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要:
A semiconductor device includes a substrate in which a cell region and contact regions located at both sides of the cell region are defined, a first source layer formed over the substrate, a second source layer formed over the first source layer, a reinforcement pattern formed in the second source layer, a stacked structure including conductive layers and insulating layers alternately stacked over the second source layer and the reinforcement pattern, channel layers passing through the stacked structure and the second source layer and electrically coupled to the second source layer, and an isolation insulating pattern passing through at least one top conductive layer of the conductive layers.
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