发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题(中): 半导体器件及其制造方法
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申请号: US14734140申请日: 2015-06-09
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公开(公告)号: US20160268263A1公开(公告)日: 2016-09-15
- 发明人: Ki Hong LEE , Seung Ho PYI
- 申请人: SK hynix Inc.
- 优先权: KR10-2015-0033817 20150311; KR10-2015-0054732 20150417
- 主分类号: H01L27/115
- IPC分类号: H01L27/115
摘要:
A semiconductor device includes a substrate in which a cell region and contact regions located at both sides of the cell region are defined, a first source layer formed over the substrate, a second source layer formed over the first source layer, a reinforcement pattern formed in the second source layer, a stacked structure including conductive layers and insulating layers alternately stacked over the second source layer and the reinforcement pattern, channel layers passing through the stacked structure and the second source layer and electrically coupled to the second source layer, and an isolation insulating pattern passing through at least one top conductive layer of the conductive layers.
公开/授权文献
- US09508730B2 Semiconductor device and manufacturing method thereof 公开/授权日:2016-11-29
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