Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US15011510Application Date: 2016-01-30
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Publication No.: US20160268445A1Publication Date: 2016-09-15
- Inventor: Atsushi AMO
- Applicant: Renesas Electronics Corporation
- Priority: JP2015-048719 20150311
- Main IPC: H01L29/792
- IPC: H01L29/792 ; H01L29/94 ; H01L29/66

Abstract:
In a semiconductor device including a split gate type MONOS memory, and a trench capacitor element having an upper electrode partially embedded in trenches formed in the main surface of a semiconductor substrate, merged therein, the flatness of the top surface of the upper electrode embedded in the trench is improved. The polysilicon film formed over the semiconductor substrate to form a control gate electrode forming a memory cell of the MONOS memory is embedded in the trenches formed in the main surface of the semiconductor substrate in a capacitor element formation region, thereby to form the upper electrode including the polysilicon film in the trenches.
Public/Granted literature
- US09755086B2 Semiconductor device and a manufacturing method thereof Public/Granted day:2017-09-05
Information query
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