Invention Application
- Patent Title: Method of virtual metrology using combined models
- Patent Title (中): 使用组合模型的虚拟计量方法
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Application No.: US14660961Application Date: 2015-03-18
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Publication No.: US20160274570A1Publication Date: 2016-09-22
- Inventor: Lian-Hua Shih , Ching-Hsing Hsieh , Feng-Chi Chung , Chia-Chi Chang , Yu-Cheng Lin , Sian-Jhu Tsai , Meng-Chih Chang , Yi-Hui Tseng
- Applicant: UNITED MICROELECTRONICS CORP.
- Main IPC: G05B19/4097
- IPC: G05B19/4097 ; G05B15/02

Abstract:
A method of virtual metrology is disclosed. Process data and measurement values corresponding to a workpiece are collected. The process data and the measurement values are used to establish a conjecture model. A theoretical model corresponding to the workpiece and the conjecture model is used to establish another conjecture model. The another conjecture model is used to establish a virtual metrology value. The virtual metrology value is used to predict properties of a subsequently manufactured workpiece.
Public/Granted literature
- US3180060A Building blocks Public/Granted day:1965-04-27
Information query
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