Invention Application
- Patent Title: HIGH CURRENT SWING-TYPE INDUCTOR AND METHODS OF FABRICATION
- Patent Title (中): 高电流摆式电感器和制造方法
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Application No.: US15054660Application Date: 2016-02-26
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Publication No.: US20160276087A1Publication Date: 2016-09-22
- Inventor: Yipeng Yan , Robert James Bogert
- Applicant: COOPER TECHNOLOGIES COMPANY
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/29
Abstract:
A surface mount swing-type inductor component is configured to establish a non-uniform gap when assembled. The non-uniform gap produces swing-type inductor functionality in a compact package for higher current applications while being manufacturable at relatively low cost.
Public/Granted literature
- US09978508B2 High current swing-type inductor and methods of fabrication Public/Granted day:2018-05-22
Information query
