发明申请
- 专利标题: Flux Recovery Device and Soldering Device
- 专利标题(中): 助焊剂回收装置和焊接装置
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申请号: US15033258申请日: 2014-06-13
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公开(公告)号: US20160279726A1公开(公告)日: 2016-09-29
- 发明人: Tsutomu Hiyama , Yuta Saito
- 申请人: SENJU METAL INDUSTRY CO., LTD.
- 优先权: JP2013-226663 20131031
- 国际申请: PCT/JP2014/065797 WO 20140613
- 主分类号: B23K3/08
- IPC分类号: B23K3/08 ; B23K1/008 ; B01D53/26 ; B23K1/00 ; B01D47/06 ; B01D47/16 ; B23K3/06 ; B23K1/20
摘要:
A flux recovery device that recovers a flux component from a gaseous mixture. The flux recovery device includes a first water spray unit that sprays water into a gaseous mixture containing the flux component, a separation unit that includes an introduction port for introducing the gaseous mixture into which water is sprayed from the first water spray unit, and a second water spray unit that forms a precipitation flow inside of the separation unit. The separation unit uses a swirling flow to separate the flux component from the gaseous mixture. A condensation unit cools water vapor generated in the separation unit to change the water vapor to water droplets, thereby removing the water vapor. Water vapor generated in a separation unit is cooled by a condensation unit, recovered as water droplets, and reused.
公开/授权文献
- US09744613B2 Flux recovery device and soldering device 公开/授权日:2017-08-29
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